Ye-PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin I-Red Glue Ekhipha I-Stencil Printing Solder

Incazelo emfushane:

Inombolo ye-CAS: akukho
MF: I-Epoxy Resin
Indawo Yomsuka: China
Ukuhlukaniswa: Ezinye Izinamathiselo
I-Main Raw Material: I-Silicone
Ukusetshenziswa: Ukwakhiwa, Ezokuthutha
Igama lomkhiqizo: QLG
Inombolo Yemodeli: YT-902
Uhlobo: Ukungathathi hlangothi
Igama lomkhiqizo: Epoxy Resin


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Iglue ebomvu ye-SMT iwuhlobo lwe-polyene epoxy resin organic compound. Uma kuqhathaniswa ne-solder paste, i-glue ebomvu izophulukisa ngemva kokushisa. Iphuzu layo lokuphulukisa lingu-150 ℃, ngemva kwalokhu, lishintsha ngokushesha lisuka kokunamathisela liye kokuqinile. Isivinini sayo esivelele sokuphulukisa, ukumelana nokushisa okuphezulu, kanye nezakhiwo zikagesi ezinhle kakhulu kwenza lokhu kube yingxenye ebalulekile ekufakweni kwe-solder. Ilungele ukucubungula uchungechunge lwe-SMT phakathi nezinqubo ze-wave soldering.

Incazelo Yomkhiqizo

Iglue ebomvu ye-SMT iwuhlobo lwe-polyene epoxy resin organic compound. Uma kuqhathaniswa ne-solder paste, i-glue ebomvu izophulukisa ngemva kokushisa. Iphuzu layo lokuphulukisa lingu-150 ℃, ngemva kwalokhu, lishintsha ngokushesha lisuka kokunamathisela liye kokuqinile. Isivinini sayo esivelele sokuphulukisa, ukumelana nokushisa okuphezulu, kanye nezakhiwo zikagesi ezinhle kakhulu kwenza lokhu kube yingxenye ebalulekile ekufakweni kwe-solder. Ilungele ukucubungula uchungechunge lwe-SMT phakathi nezinqubo ze-wave soldering.

1. Izakhiwo ngaphambi kokwelapha

Into

Ipharamitha

Umbala

Okubomvu

Amandla adonsela phansi akhethekile (25℃,g/cm^3)

1.3

I-Viscosity (25 ℃, 10rpm, pa/s)

70

Thixotropic Index

105±10

I-Flash Point (i-TCC)

> 95℃

Usayizi Wezinhlayiyana

15μm

I-Copper Mirror Test

Akukho Ukugqwala

 

2. Izakhiwo ngemuva kokwelashwa

Into

Ipharamitha

Umbala

Okubomvu

Ukuminyana(25℃)

1.3±0.1 g/cm^3

I-Coefficient of Thermal Expansion

25-70℃;51

90-150℃;160

Ukungazweli Kwevolumu(25℃)

2.0*10^16 Ω/cm

Ukushisa Okuthize

0.3 KJ/Kg.K

I-Glass Transition Temperature

105℃

I-Dielectric Constant

3.8 (100KHZ)

I-Dielectric Tangent

0.014 (100KHZ)

Amandla Shear

24 n/m

Amandla Okukhipha

61 n

Amandla e-Torque

52 n.mm

Ukuhlolwa Kwesimo Sokwelapha

Ijika lokupholisa elilondoloziwe liboniswa ngezansi

umkhiqizo (1)

Izimo ezifanele zokuphulukisa zivame ukushisa ku-150 ° C imizuzwana engu-90-120. Ubudlelwano phakathi kwesivinini sokuphulukisa namandla okugcina okubopha kanye nezinga lokushisa lokuphulukisa nesikhathi kuboniswa ngezansi

umkhiqizo (3)

Enkambweni yangempela yokukhiqiza, sonke isikhathi sokushisa side kunomfanekiso, ngoba kunesikhathi sokushisa.


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