Fun PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resini Pupa Pipa Dispensing Stencil Printing Solder
SMT pupa lẹ pọ jẹ iru polyene iposii resini Organic yellow. Akawe si solder lẹẹ, awọn pupa lẹ pọ yoo ni arowoto lẹhin ti o ti wa ni kikan. Aaye imularada rẹ jẹ 150 ℃, lẹhin eyi, o yipada lẹsẹkẹsẹ lati lẹẹ si ri to. Iyara imularada ti iyalẹnu rẹ, resistance ooru giga, ati awọn ohun-ini ina mọnamọna ti o dara julọ jẹ ki eyi jẹ paati pataki ni titaja. O jẹ apẹrẹ fun sisẹ jara SMT lakoko awọn ilana titaja igbi.
ọja Apejuwe
SMT pupa lẹ pọ jẹ iru polyene iposii resini Organic yellow. Akawe si solder lẹẹ, awọn pupa lẹ pọ yoo ni arowoto lẹhin ti o ti wa ni kikan. Aaye imularada rẹ jẹ 150 ℃, lẹhin eyi, o yipada lẹsẹkẹsẹ lati lẹẹ si ri to. Iyara imularada ti iyalẹnu rẹ, resistance ooru giga, ati awọn ohun-ini ina mọnamọna ti o dara julọ jẹ ki eyi jẹ paati pataki ni titaja. O jẹ apẹrẹ fun sisẹ jara SMT lakoko awọn ilana titaja igbi.
| 1. Properties ṣaaju ki o to curing | |
| Nkan | Paramita |
| Àwọ̀ | Pupa |
| Agbara pataki (25℃, g/cm^3) | 1.3 |
| Viscosity (25 ℃, 10rpm, pa/s) | 70 |
| Thixotropic Atọka | 105±10 |
| Aaye Flash (TCC) | > 95 ℃ |
| Patiku Iwon | 15μm |
| Idanwo Digi Ejò | Ko si Ibaje |
| 2. Awọn ohun-ini lẹhin imularada | |
| Nkan | Paramita |
| Àwọ̀ | Pupa |
| Ìwọ̀n (25℃) | 1,3 ± 0,1 g / cm ^ 3 |
|
olùsọdipúpọ ti Gbona Imugboroosi | 25-70℃;51 |
| 90-150℃;160 | |
| Resistivity (25℃) | 2.0*10^16 Ω/cm |
| Ooru pato | 0.3 KJ/Kg.K |
| Gilasi Iyipada otutu | 105 ℃ |
| Dielectric Constant | 3.8 (100KHZ) |
| Dielectric Tangent | 0.014 (100KHZ) |
| Irẹrun Agbara | 24 n/m |
| Fa-jade Agbara | 61 n |
| Agbara Torque | 52 n.mm |
Idanwo Ipò Curing
Ti a ti fipamọ curing ti tẹ ni han ni isalẹ
Awọn ipo imularada ti o yẹ jẹ alapapo gbogbogbo ni 150 ° C fun awọn aaya 90-120. Ibasepo laarin iyara imularada ati agbara isọdọmọ ipari ati iwọn otutu imularada ati akoko ti han ni isalẹ
Ninu ilana iṣelọpọ gangan, gbogbo akoko alapapo gun ju nọmba naa, nitori pe akoko igbona kan wa.
