Sn96.5Ag3.0Cu0.5 Lead yasimahla ye-SAC305 yocingo lweSilver Solder

Ingcaciso yeMveliso

I-Lead-Free Sn96.5Ag3.0Cu0.5 yenziwe nge-96.5% ye-tin, i-3% yesilivere, kunye ne-0.5% yobhedu. Ibonisa ixabiso eliphezulu, kodwa i-solder ekhanyayo kunye nokusebenza okubalaseleyo. Inkampani yethu ifumene isatifikethi sokuFikelela kunye nesatifikethi se-RoHS kwiimveliso zodidi olungakhokelela.

Ububanzi bocingo bufikelela kwi-0.15mm. Ngenxa yokwamkelwa kwezinto eziluhlaza ezicocekileyo, imveliso yethu inokubonelela ngobumanzi obugqithisileyo ngexesha lenkqubo yokuthengisela. Inokunciphisa kakhulu iingxaki zobugcisa ezinje ngebhulorho, umkhenkce, kunye nezinye. Ifanelekile kuzo zombini iinkqubo zokuthengisa amaza kunye nediphu, ezinemfuno ephezulu yokhuseleko lokusingqongileyo.

Inkampani yethu ifumene isatifikethi sokuFikelela kunye nesatifikethi se-RoHS kwiimveliso zodidi olungakhokelela, kunye nesatifikethi se-SGS.

Isicelo

I-Sn96.5Ag3.0Cu0.5 i-solder paste ingasetyenziselwa ukuthengiswa kwee-chips zekhompyutheni ezichanekileyo, ii-chips zefowuni eziphathwayo, i-LED, ibhodi yesekethe eprintiweyo (PCB), kunye neebhodi zeesekethe ze-elektroniki ezichanekileyo, phakathi kwabanye. Okwangoku, ifanelekile ukubuyiselwa kwezixhobo ze-elektroniki ezincinci.

Iiparamitha

Iimbonakalo

1.I-High Resistivity yoMbane kunye ne-Elective Conductivity
Ngenxa yokongezwa kobhedu, le Sn96.5Ag3.0Cu0.5 ucingo lwe-solder luvumela amacandelo e-elektroniki ukuba avelise umbane ophezulu wokumelana nombane ngexesha lenkqubo yokuthengisa.

2.Iimpembelelo eziMangalisayo zeSoldering, isantya sokuthengisa ngokukhawuleza, iPropati eNgcono yokumanzisa, kunye nokuGqeka okuLungileyo

I-3.I-rosin flux esebenzayo kule mveliso inokunika umphumo ophezulu wokuguquguquka.

Ukunikezelwa kweMveliso