Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4
Product Description
Tin Lead Solder Pastes are made from high purity metal, The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made with 62.8% tin, 36.8% lead, and 0.4% silver content..
This kind of solder paste is a no-clean type solder cream designed for SMT production process. The paste m. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.
Features
1.With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components.
2.There are very few changes of viscosity during the continuous printing process.
3.The original shape will not be changed after several hours of printing. In addition, the surface mount assembly will not be affected.
4.Favorable wetting property on the substrate made from different materials.
Storage
Solder paste had better to be stored at a temperature range from 3℃ to 7℃. The shelf life of the unsealed product is 6 months. Furthermore, we have special one that can be stored at room temperature.
equipment.
Parameters
|
Spec |
Sn62.8Pb36.8Ag0.4 |
|
Melting point |
183℃ |
|
Specific Gravity |
8.79g/cm3 |
|
Weight |
500g/pcs, 10kg/carton, and available with syringe packing |
|
Copper Mirror Test |
PASS |
Product Offerings
|
Alloy |
Powder Size |
Type |
|
Sn63Pb37 |
T3、T4 |
No-Clean |
|
Sn55Pb45 |
T3、T4 |
No-Clean |
|
Sn0.2AgPb |
T3、T4 |
No-Clean |
|
Sn0.4AgPb |
T3、T4 |
No-Clean |
|
Sn2.5Ag92.5Pb |
T3、T4 |
No-Clean |
FAQ
1.What are your prices?
Our prices are subject to change depending on market factors and LME. We will send you an updated price list after your company contact us for further information.
2.What are the price and payment terms?
The price terms involve EXW, FOB and CIF; The payment terms can be T/T.
3.What is the minimum order quantity of solder products?
The MOQ of solder wire is 40kg. The MOQ of solder bar is 20kg. The MOQ of solder paste is 20kg.
