Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Solder Wire 0.8mm
Sn96.5Ag3.0Cu0.5 e sa Keneng Pele e entsoe ka 96.5% tin, 3% silevera, le 0.5% koporo. E na le litšenyehelo tse batlang li le holimo, empa manonyeletso a khanyang a solder le ts'ebetso e ikhethang. Khamphani ea rona e fumane setifikeiti sa Reach le setifikeiti sa RoHS bakeng sa lihlahisoa tsa mofuta o se nang lead. Ho boetse ho na le terata e tiileng.
Bophara ba terata bo fihla ho 0.15mm. Ka lebaka la ho amoheloa ha lisebelisoa tse tala tse phahameng, sehlahisoa sa rona se ka fana ka metsi a mangata haholo nakong ea ts'ebetso ea soldering. E ka fokotsa haholo mathata a tekheniki a kang borokho, leqhoa le tse ling. E nepahetse bakeng sa lits'ebetso tsa wave soldering le dip soldering, tse nang le tlhoko e phahameng ea ts'ireletso ea tikoloho.
Khamphani ea rona e fumane setifikeiti sa Reach le setifikeiti sa RoHS bakeng sa lihlahisoa tsa mofuta o se nang lead, hammoho le setifikeiti sa SGS.
Kopo
Mohala oa solder oa Sn96.5Ag3.0Cu0.5 o ka sebelisoa bakeng sa ho kopanya li-chips tse nepahetseng tsa khomphutha, li-chips tsa mehala ea thelefono, LED, boto ea potoloho e hatisitsoeng (PCB), le liboto tse fapaneng tse nepahetseng haholo tsa elektroniki, har'a tse ling. Ho sa le joalo, e loketse ho tsosolosoa ha lisebelisoa tsa elektronike tse nyenyane.
Mekhahlelo
| Spec | Sn96.5/Ag3.0/Cu0.5 | |||||||||
| Sebaka se qhibilihang | 217 ℃ | |||||||||
| Matla a Khoheli a khethehileng | 7.4g/cm3 | |||||||||
| Boima ba 'mele | 450g/roll, 900g/roll, boima bo bong bo ka etsoa | |||||||||
| Diameter | 0.15mm-5.0mm | |||||||||
| Lisebelisoa | ||||||||||
| Sn | Ag | Cu | Bi | Sb | Zn | Pb | Ni | Fe | As | Al |
| 96.5±1.0 | 3.0±0.2 | 0.5±0.2 | 0.1 Max | 0.1 Max | 0.001 Max | 0.07 Max | 0.01 Max | 0.02 Max | 0.03 Max | 0.001 Max |
Likaroloana
1.High Motlakase Resistivity le Motlakase Conductivity
Ka lebaka la ho eketsoa ha koporo, mohala ona oa solder oa Sn96.5Ag3.0Cu0.5 o lumella likarolo tsa elektronike ho hlahisa matla a mangata a ho hanyetsa motlakase nakong ea ts'ebetso ea soldering.
2. Liphello tse Ntle tsa Soldering, Potlako ea ho Soldering, Thepa e Ntle ea ho Wetting, le Mokelikeli o Molemo.
3.The activated rosin flux sehlahisoa sena e ka fana ka phello e phahameng ea fluxing.
- Mohala o nang le li-cored o tloaelehile ka 2% flux core. Li-flux core % tse ling lia fumaneha ha u li kopa.
- Khoele ea cored e fumaneha ho Sn/Pb, Sn/Ag/Cu, SN100 le li-alloys tse ling tsa tloaelo ha u e kopa.
- Lisebelisoa tsena tsa solder li etsoa ho kopana le maemo a IPC J-STD-006.
- Liphesente tse ling tsa flux, li-alloys, li-diameter le boholo ba spool li ka fumaneha ka kopo e khethehileng
