Bakeng sa PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder
SMT red glue ke mofuta oa polyene epoxy resin organic compound. Ha ho bapisoa le sekhomaretsi sa solder, sekhomaretsi se khubelu se tla folisa ka mor'a hore se futhumale. Sebaka sa eona sa ho folisa ke 150 ℃, ka mor'a sena, hang-hang e fetoha ho tloha ho peista ho ea ho tiileng. Lebelo la eona le ikhethang la ho folisa, ho thibela mocheso o phahameng, le lisebelisoa tse ntle tsa motlakase li etsa hore sena e be karolo ea bohlokoa ho solder. E loketse ho sebetsana le letoto la li-SMT nakong ea lits'ebetso tsa wave soldering.
Tlhaloso ea Sehlahisoa
SMT red glue ke mofuta oa polyene epoxy resin organic compound. Ha ho bapisoa le sekhomaretsi sa solder, sekhomaretsi se khubelu se tla folisa ka mor'a hore se futhumale. Sebaka sa eona sa ho folisa ke 150 ℃, ka mor'a sena, hang-hang e fetoha ho tloha ho peista ho ea ho tiileng. Lebelo la eona le ikhethang la ho folisa, ho thibela mocheso o phahameng, le lisebelisoa tse ntle tsa motlakase li etsa hore sena e be karolo ea bohlokoa ho solder. E loketse ho sebetsana le letoto la li-SMT nakong ea lits'ebetso tsa wave soldering.
| 1. Thepa pele ho phekoloa | |
| Ntho | Paramethara |
| Mmala | Khubedu |
| Matla a khoheli a khethehileng (25℃,g/cm^3) | 1.3 |
| Viscosity (25 ℃, 10rpm, pa/s) | 70 |
| Thixotropic Index | 105±10 |
| Flash Point (TCC) | >95℃ |
| Boholo ba Karolo | 15μm |
| Teko ea Seipone ea Koporo | Ha ho Corrosion |
| 2. Thepa ka mor'a ho phekola | |
| Ntho | Paramethara |
| Mmala | Khubedu |
| Boima ba 'mele (25℃) | 1.3±0.1 g/cm^3 |
|
Coefficient ea Katoloso ea Thermal | 25-70 ℃;51 |
| 90-150 ℃;160 | |
| Ho hanyetsa Bophahamo (25℃) | 2.0*10^16 Ω/cm |
| Mocheso o khethehileng | 0.3 KJ/Kg.K |
| Mocheso oa Phetoho ea Khalase | 105 ℃ |
| Dielectric Constant | 3.8 (100KHZ) |
| Dielectric Tangent | 0.014 (100KHZ) |
| Matla a Shear | 24 n/m |
| Ho hula Matla | 61 n |
| Matla a Torque | 52 n.mm |
Phekolo ea Boemo ba Teko
Sekhahla sa pholiso se bolokiloeng se bontšitsoe ka tlase
Maemo a loketseng a ho folisa hangata a futhumatsa ka 150 ° C bakeng sa metsotsoana e 90-120. Kamano pakeng tsa lebelo la ho folisa le matla a ho qetela a tlamahano le mocheso oa ho folisa le nako e bontšitsoe ka tlase
Ts'ebetsong ea sebele ea tlhahiso, nako eohle ea ho futhumatsa e telele ho feta palo, hobane ho na le nako ea ho futhumatsa pele.
