For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder
SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.
Product Description
SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.
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1. Properties before curing |
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Item |
Parameter |
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Color |
Red |
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Special gravity（25℃，g/cm^3） |
1.3 |
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Viscosity（25℃，10rpm，pa/s） |
70 |
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Thixotropic Index |
105±10 |
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Flash Point（TCC） |
>95℃ |
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Particle Size |
15μm |
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Copper Mirror Test |
No Corrosion |
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2. Properties after curing |
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Item |
Parameter |
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Color |
Red |
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Density(25℃) |
1.3±0.1 g/cm^3 |
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Coefficient of Thermal Expansion |
25-70℃；51 |
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90-150℃；160 |
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Volume Resistivity(25℃) |
2.0*10^16 Ω/cm |
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Specific Heat |
0.3 KJ/Kg.K |
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Glass Transition Temperature |
105℃ |
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Dielectric Constant |
3.8 (100KHZ) |
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Dielectric Tangent |
0.014 (100KHZ) |
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Shear Strength |
24 n/m |
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Pull-out Strength |
61 n |
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Torque Strength |
52 n.mm |
Curing Condition Test
The saved curing curve is shown below
The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below
In actual production process, the entire heating time is longer than the figure, because there is a preheating time.
