Produiten
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Sn99.3Cu0.7 Koffer Tin Lead Free Solder Bar
● Sn0.7Cu
● Made with ultra pure Rohmaterial -
QL-700A Waasser-baséiert Cleaner
● Waasser-baséiert Cleaner
● Flëssegket -
No-Clean Liquid Solder Flux
● Eng Vielfalt vu Formen, Gréissten a Fluxtypen
● Made with ultra pure Rohmaterial -
Solder Preform mat Flux a No Flux
● Eng Vielfalt vu Formen, Gréissten a Fluxtypen
● Made with ultra pure Rohmaterial -
Zinn Bläi Sn / Pb Solder Bar Bläi an ouni Bläi
● Bleift a Bläifräi
● Made with ultra pure Rohmaterial
● Niddereg Dross an Héich Antioxid -
Zinn Bläi Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4
● Solder Paste
● Made with ultra pure Rohmaterial
● Typ3, Typ4 -
Sn96.5Ag3.0Cu0.5 Bläifräi SAC305 Sëlwer Solder Drot
● Bläilos solder Drot
● Made with ultra pure Rohmaterial
● Passéiert SGS, RoHS, Reach Zertifikat -
Type3 Tin Lead Sn63Pb37 Solder Paste Fir PCB
● Tin Lead solder Paste
● Made with ultra pure Rohmaterial
● Typ3, Typ4 -
Sn99.3Cu0.7 Koffer Tin Lead Free Solder Drot
● Sn0.7Cu solder Drot
● No-propper solder Drot
● Made with ultra pure Rohmaterial
● Duerchmiesser: 0,15-5,0 mm -
Sn96.5Ag3.0Cu0.5 Bläifräi SAC305 Solderdraht 0,8 mm
● Bläilos solder Drot
● Made with ultra pure Rohmaterial
● Duerchmiesser: 0,15-5,0 mm
● Passéiert SGS, RoHS, Reach Zertifikat -
Sn63Pb37 No-Clean Leaded Tin Solder Drot
● No-propper leaded solder Drot
● Made with ultra pure Rohmaterial
● Rosin Cored a fest Cored
● Duerchmiesser: 0,12-5,0 mm -
Fir PCB BGA SMT Klebstoff Dichtung 200g Tube Epoxyharz Rout Klebstoff Ausdeelung Schabloun Dréckerei Solder
CAS Nr.: keng
MF: Epoxyharz
Plaz vun Urspronk: China
Klassifikatioun: Aner Klebstoff
Main Matière première: Silikon
Benotzung: Bau, Transport
Markennumm: QLG
Modell Zuel: YT-902
Typ: Neutral
Produit Numm: Epoxy Resin