Maka PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder
SMT red gluu bụ ụdị polyene epoxy resin organic compound. E jiri ya tụnyere tapawa solder, gluu na-acha uhie uhie ga-agwọta ma ọ kpoo ọkụ. Ebe ọgwụgwọ ya bụ 150 ℃, mgbe nke a gasịrị, ọ na-agbanwe ozugbo site na mado gaa na nke siri ike. Ọsọ ọgwụgwọ ya pụtara ìhè, nguzogide okpomọkụ dị elu, yana akụrụngwa eletrik mara mma na-eme ka nke a bụrụ akụkụ dị mkpa na ire ere. Ọ dị mma maka nhazi usoro SMT n'oge usoro ire ere.
Nkọwa ngwaahịa
SMT red gluu bụ ụdị polyene epoxy resin organic compound. E jiri ya tụnyere tapawa solder, gluu na-acha uhie uhie ga-agwọta ma ọ kpoo ọkụ. Ebe ọgwụgwọ ya bụ 150 ℃, mgbe nke a gasịrị, ọ na-agbanwe ozugbo site na mado gaa na nke siri ike. Ọsọ ọgwụgwọ ya pụtara ìhè, nguzogide okpomọkụ dị elu, yana akụrụngwa eletrik mara mma na-eme ka nke a bụrụ akụkụ dị mkpa na ire ere. Ọ dị mma maka nhazi usoro SMT n'oge usoro ire ere.
| 1. Ngwongwo tupu ọgwụgwọ | |
| Ihe | Oke |
| Agba | Uhie |
| Ike ndọda pụrụ iche (25℃, g/cm^3) | 1.3 |
| Viscosity (25 ℃, 10rpm, pa/s) | 70 |
| Ndepụta nke Thixotropic | 105± 10 |
| Ebe Flash (TCC) | > 95 ℃ |
| Nha urughuru | 15μm |
| Nnwale enyo ọla kọpa | Enweghị corrosion |
| 2. Ngwongwo mgbe agwọchara | |
| Ihe | Oke |
| Agba | Uhie |
| Njupụta (25 ℃) | 1.3±0.1 g/cm^3 |
|
Ọnụọgụ nke Thermal Mgbasawanye | 25-70 ℃;51 |
| 90-150 ℃; 160 | |
| Nkwụghachi olu (25 ℃) | 2.0*10^16 Ω/cm |
| Okpomọkụ akọwapụtara | 0.3 KJ/Kg.K |
| Okpomọkụ mgbanwe iko | 105 ℃ |
| Dielectric Constant | 3.8 (100KHZ) |
| Tangent dielectric | 0.014 (100KHZ) |
| Ike Shear | 24 n/m |
| Dụpụta Ike | 61 n |
| Ike Torque | 52 n.mm |
Nnwale ọnọdụ ọgwụgwọ
Egosiri usoro ọgwụgwọ echekwara n'okpuru
Ọnọdụ ọgwụgwọ kwesịrị ekwesị na-ekpo ọkụ na 150 Celsius C maka 90-120 sekọnd. E gosipụtara mmekọrịta dị n'etiti ọgwụgwọ ọsọ na ike njikọ ikpeazụ na ọgwụgwọ okpomọkụ na oge n'okpuru
N'ime usoro mmepụta n'ezie, oge kpo oku dum dị ogologo karịa ọnụ ọgụgụ ahụ, n'ihi na enwere oge ikpo ọkụ.
