Kino Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4

Hōʻike huahana

Hana ʻia ʻo Tin Lead Solder Pastes mai ka metala maʻemaʻe kiʻekiʻe, ʻo ka Sn62.8Pb36.8Ag0.4 kahi mea hoʻoheheʻe ma waena o ka wela. Hana ʻia kona alloy me 62.8% tin, 36.8% lead, a me 0.4% kala kālā.

ʻO kēia ʻano solder paste he ʻano hoʻomaʻemaʻe ʻole i hoʻolālā ʻia no ke kaʻina hana SMT. ʻO ka paʻi m. Ma hope o ka reflow soldering, he emi ke koena, kiʻekiʻe ili insulation kū'ē, paʻa a hilinaʻi uila hana.

Nā hiʻohiʻona

1. Me ka wai maikaʻi a me ka hopena kūʻai maikaʻi, hiki i ka paʻi solder ke hoʻokō i ka paʻi pololei o nā ʻāpana kaapuni.

2. He liʻiliʻi loa nā hoʻololi o ka viscosity i ka wā e paʻi mau ana.

3. ʻAʻole e hoʻololi ʻia ke ʻano kumu ma hope o kekahi mau hola o ka paʻi ʻana. Eia kekahi, ʻaʻole e hoʻopilikia ʻia ka hui mauna ili.

4.Favorable pulu waiwai ma luna o ka substrate i hanaia mai na mea like ole.

Waihona

ʻOi aku ka maikaʻi o ka mālama ʻana i ka pāpaʻi solder ma kahi wela wela mai 3 ℃ a 7 ℃. ʻO ke ola o ka huahana unsealed he 6 mahina. Eia kekahi, loaʻa iā mākou kahi mea kūikawā hiki ke mālama ʻia ma ka lumi wela.

mea lako.

Nā ʻāpana

Hāʻawi huahana

FAQ

1. He aha kāu mau kumukūʻai?
Hiki ke hoʻololi i kā mākou mau kumukūʻai ma muli o nā kumu mākeke a me LME. E hoʻouna mākou iā ʻoe i kahi papa inoa kūʻai hou ma hope o ka hoʻopili ʻana o kāu hui iā mākou no ka ʻike hou aku.

2.He aha ke kumukūʻai a me nā hua'ōlelo uku?
ʻO nā hua'ōlelo kumukūʻai e pili ana iā EXW, FOB a me CIF; ʻO nā hua'ōlelo uku hiki ke T / T.

3.He aha ka palena liʻiliʻi o nā huahana solder?
ʻO ka MOQ o ka uwea solder he 40kg. ʻO ka MOQ o ka pahu solder he 20kg. ʻO ka MOQ o ka solder paste he 20kg.