Don PCB BGA SMT Adhesive Hatimin 200g Tube Epoxy Resin Red Manni Mai Rarraba Solder Buga Stencil
SMT ja manne wani nau'in polyene epoxy resin Organic fili ne. Idan aka kwatanta da manna solder, jan man zai warke bayan ya yi zafi. Its curing batu ne 150 ℃, bayan wannan, shi nan da nan ya canza daga manna zuwa m. Fitaccen saurin warkewar sa, babban juriya na zafi, da ingantattun kaddarorin lantarki sun sa wannan muhimmin sashi a cikin siyarwa. Yana da manufa don sarrafa jerin SMT yayin tafiyar matakai na siyarwar igiyar ruwa.
Bayanin Samfura
SMT ja manne wani nau'in polyene epoxy resin Organic fili ne. Idan aka kwatanta da manna solder, jan man zai warke bayan ya yi zafi. Its curing batu ne 150 ℃, bayan wannan, shi nan da nan ya canza daga manna zuwa m. Fitaccen saurin warkewar sa, babban juriya na zafi, da ingantattun kaddarorin lantarki sun sa wannan muhimmin sashi a cikin siyarwa. Yana da manufa don sarrafa jerin SMT yayin tafiyar matakai na siyarwar igiyar ruwa.
1. Properties kafin curing | |
Abu | Siga |
Launi | Ja |
Nauyin nauyi na musamman (25℃, g/cm^3) | 1.3 |
Dankowa (25 ℃, 10rpm, pa/s) | 70 |
Thixotropic Index | 105± 10 |
Flash Point (TCC) | > 95 ℃ |
Girman Barbashi | 15 μm |
Gwajin Madubin Copper | Babu Lalata |
2. Properties bayan curing | |
Abu | Siga |
Launi | Ja |
Girma (25 ℃) | 1.3 ± 0.1 g/cm^3 |
Coefficient na Thermal Expansion | 25-70 ℃; 51 |
90-150 ℃; 160 | |
Juyin Juriya (25 ℃) | 2.0*10^16 Ω/cm |
Takamaiman Zafi | 0.3 KJ/Kg.K |
Yanayin Canjin Gilashin | 105 ℃ |
Dielectric Constant | 3.8 (100KHZ) |
Dielectric Tangent | 0.014 (100KHZ) |
Ƙarfin Shear | 24 n/m |
Fitar da Ƙarfi | 61n ku |
Ƙarfin Ƙarfi | 52n ku |
Gwajin Yanayin Magani
Ana nuna madaidaicin maganin warkewa a ƙasa
Yanayin warkewa da ya dace gabaɗaya suna dumama a 150 ° C don 90-120 seconds. Dangantakar da ke tsakanin saurin warkewa da ƙarfin haɗin gwiwa na ƙarshe da zafin zafin jiki da lokaci ana nuna su a ƙasa
A cikin ainihin tsarin samarwa, duk lokacin dumama ya fi tsayi fiye da adadi, saboda akwai lokacin preheating.