China wholesale Tin Paste For Soldering Suppliers – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG
China wholesale Tin Paste For Soldering Suppliers – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:
Product Description
Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.
The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.
Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.
Application
The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.
Parameters
|
Spec |
Sn96.5/Ag3.0/Cu0.5 |
|
Melting point |
217℃ |
| Specific Gravity |
7.4g/cm3 |
|
Weight |
450g/roll, 900g/roll, other weights can be customized |
Features
1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.
2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness
3.The activated rosin flux in this product can offer superior fluxing effect.
Product Offerings
|
Alloy |
Powder Size |
Melting Point ℃ |
Description |
|
Sn0.3Ag0.7Cu |
T3、T4 |
217-227 |
High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed. |
|
Sn1.0Ag0.5Cu |
T3、T4 |
217-227 |
|
|
Sn3.0Ag0.5Cu |
T3、T4 |
217-220 |
|
|
Sn35Bi0.3Ag |
T3、T4 |
172 |
Mid-temp，Fast flowing solder |
|
Sn35Bi1Ag |
T3、T4 |
151-189 |
|
|
Sn42Bi58 |
T3、T4 |
138 |
Low melting point around 138℃Good wetting characteristics |
Product detail pictures:
Related Product Guide:
We've been committed to offering easy,time-saving and money-saving one-stop purchasing support of consumer for China wholesale Tin Paste For Soldering Suppliers – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG , The product will supply to all over the world, such as: Lisbon, Peru, European, We've got won a good reputation among overseas and domestic clients. Adhering to the management tenet of "credit oriented, customer first, high efficiency and mature services", we warmly welcome friends from all walks of life to cooperate with us.
By Pearl Permewan from Borussia Dortmund - 2018.11.22 12:28
The sales manager is very patient, we communicated about three days before we decided to cooperate, finally, we are very satisfied with this cooperation!
By Phoenix from Slovenia - 2018.02.21 12:14
