China wholesale Solder Tinning Paste Manufacturer – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG
China wholesale Solder Tinning Paste Manufacturer – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:
Product Description
Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.
The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.
Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.
Application
The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.
Parameters
|
Spec |
Sn96.5/Ag3.0/Cu0.5 |
|
Melting point |
217℃ |
| Specific Gravity |
7.4g/cm3 |
|
Weight |
450g/roll, 900g/roll, other weights can be customized |
Features
1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.
2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness
3.The activated rosin flux in this product can offer superior fluxing effect.
Product Offerings
|
Alloy |
Powder Size |
Melting Point ℃ |
Description |
|
Sn0.3Ag0.7Cu |
T3、T4 |
217-227 |
High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed. |
|
Sn1.0Ag0.5Cu |
T3、T4 |
217-227 |
|
|
Sn3.0Ag0.5Cu |
T3、T4 |
217-220 |
|
|
Sn35Bi0.3Ag |
T3、T4 |
172 |
Mid-temp，Fast flowing solder |
|
Sn35Bi1Ag |
T3、T4 |
151-189 |
|
|
Sn42Bi58 |
T3、T4 |
138 |
Low melting point around 138℃Good wetting characteristics |
Product detail pictures:
Related Product Guide:
We enjoy an extremely good status among our prospects for our great merchandise top quality, competitive price and the ideal service for China wholesale Solder Tinning Paste Manufacturer – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG , The product will supply to all over the world, such as: Senegal, Milan, California, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We have been looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!
By Arlene from South Korea - 2017.12.09 14:01
The customer service reprersentative explained very detailed, service attitude is very good, reply is very timely and comprehensive, a happy communication! We hope to have a opportunity to cooperate.
By Jane from Netherlands - 2018.09.16 11:31
