China wholesale Solder Preform with Flux and No Flux Manufacturer – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG
China wholesale Solder Preform with Flux and No Flux Manufacturer – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG Detail:
SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.
Product Description
SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.
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1. Properties before curing |
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Item |
Parameter |
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Color |
Red |
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Special gravity（25℃，g/cm^3） |
1.3 |
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Viscosity（25℃，10rpm，pa/s） |
70 |
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Thixotropic Index |
105±10 |
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Flash Point（TCC） |
>95℃ |
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Particle Size |
15μm |
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Copper Mirror Test |
No Corrosion |
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2. Properties after curing |
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Item |
Parameter |
|
Color |
Red |
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Density(25℃) |
1.3±0.1 g/cm^3 |
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Coefficient of Thermal Expansion |
25-70℃；51 |
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90-150℃；160 |
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Volume Resistivity(25℃) |
2.0*10^16 Ω/cm |
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Specific Heat |
0.3 KJ/Kg.K |
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Glass Transition Temperature |
105℃ |
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Dielectric Constant |
3.8 (100KHZ) |
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Dielectric Tangent |
0.014 (100KHZ) |
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Shear Strength |
24 n/m |
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Pull-out Strength |
61 n |
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Torque Strength |
52 n.mm |
Curing Condition Test
The saved curing curve is shown below
The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below
In actual production process, the entire heating time is longer than the figure, because there is a preheating time.
Product detail pictures:
Related Product Guide:
Our pursuit and enterprise goal is to "Always satisfy our customer requirements". We keep on to establish and style and design outstanding top quality goods for both our outdated and new prospects and realize a win-win prospect for our clientele likewise as us for China wholesale Solder Preform with Flux and No Flux Manufacturer – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG , The product will supply to all over the world, such as: Germany, Argentina, Latvia, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which will be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we are going to continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.
By Samantha from Mongolia - 2018.09.29 13:24
This enterprise in the industry is strong and competitive, advancing with the times and develop sustainable, we are very pleased to have a opportunity to cooperate!
By Rose from Jamaica - 2017.05.02 18:28
