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China wholesale Solder Preform with Flux and No Flux Factory – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG

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China wholesale Solder Preform with Flux and No Flux Factory – For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG Detail:

SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.

Product Description

SMT red glue is a kind of polyene epoxy resin organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.

1. Properties before curing

Item

Parameter

Color

Red

Special gravity(25℃,g/cm^3)

1.3

Viscosity(25℃,10rpm,pa/s)

70

Thixotropic Index

105±10

Flash Point(TCC)

>95℃

Particle Size

15μm

Copper Mirror Test

No Corrosion

 

2. Properties after curing

Item

Parameter

Color

Red

Density(25℃)

1.3±0.1 g/cm^3

Coefficient of Thermal Expansion

25-70℃;51

90-150℃;160

Volume Resistivity(25℃)

2.0*10^16 Ω/cm

Specific Heat

0.3 KJ/Kg.K

Glass Transition Temperature

105℃

Dielectric Constant

3.8 (100KHZ)

Dielectric Tangent

0.014 (100KHZ)

Shear Strength

24 n/m

Pull-out Strength

61 n

Torque Strength

52 n.mm

Curing Condition Test

The saved curing curve is shown below

product (1)

The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below

product (3)

In actual production process, the entire heating time is longer than the figure, because there is a preheating time.


Product detail pictures:

China wholesale Solder Preform with Flux and No Flux Factory –  For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG detail pictures

China wholesale Solder Preform with Flux and No Flux Factory –  For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG detail pictures

China wholesale Solder Preform with Flux and No Flux Factory –  For PCB BGA SMT Adhesive Seal 200g Tube Epoxy Resin Red Glue Dispensing Stencil Printing Solder – QLG detail pictures


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  • This company has the idea of "better quality, lower processing costs, prices are more reasonable", so they have competitive product quality and price, that's the main reason we chose to cooperate.
    5 Stars By Eileen from venezuela - 2017.02.14 13:19
    Timely delivery, strict implementation of the contract provisions of the goods, encountered special circumstances, but also actively cooperate, a trustworthy company!
    5 Stars By Fiona from Philippines - 2018.06.26 19:27
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