China wholesale Solder Paste Sn3.0ag0.5cu T3 Factories – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG

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China wholesale Solder Paste Sn3.0ag0.5cu T3 Factories – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:

Product Description

Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.

The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.

Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.

Application

The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.

Parameters

Spec	Sn96.5/Ag3.0/Cu0.5
Melting point	217℃
Specific Gravity	7.4g/cm³
Weight	450g/roll, 900g/roll, other weights can be customized

Features

1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.

2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness

3.The activated rosin flux in this product can offer superior fluxing effect.

Product Offerings

Alloy	Powder Size	Melting Point ℃	Description
Sn0.3Ag0.7Cu	T3、T4	217-227	High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed.
Sn1.0Ag0.5Cu	T3、T4	217-227
Sn3.0Ag0.5Cu	T3、T4	217-220
Sn35Bi0.3Ag	T3、T4	172	Mid-temp，Fast flowing solder
Sn35Bi1Ag	T3、T4	151-189
Sn42Bi58	T3、T4	138	Low melting point around 138℃Good wetting characteristics

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