China wholesale Solder Paste Reflow Temperature Manufacturers – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG
China wholesale Solder Paste Reflow Temperature Manufacturers – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:
Product Description
Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.
The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.
Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.
Application
The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.
Parameters
|
Spec |
Sn96.5/Ag3.0/Cu0.5 |
|
Melting point |
217℃ |
| Specific Gravity |
7.4g/cm3 |
|
Weight |
450g/roll, 900g/roll, other weights can be customized |
Features
1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.
2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness
3.The activated rosin flux in this product can offer superior fluxing effect.
Product Offerings
|
Alloy |
Powder Size |
Melting Point ℃ |
Description |
|
Sn0.3Ag0.7Cu |
T3、T4 |
217-227 |
High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed. |
|
Sn1.0Ag0.5Cu |
T3、T4 |
217-227 |
|
|
Sn3.0Ag0.5Cu |
T3、T4 |
217-220 |
|
|
Sn35Bi0.3Ag |
T3、T4 |
172 |
Mid-temp，Fast flowing solder |
|
Sn35Bi1Ag |
T3、T4 |
151-189 |
|
|
Sn42Bi58 |
T3、T4 |
138 |
Low melting point around 138℃Good wetting characteristics |
Product detail pictures:
Related Product Guide:
"Sincerity, Innovation, Rigorousness, and Efficiency" will be the persistent conception of our company to the long-term to establish together with customers for mutual reciprocity and mutual gain for China wholesale Solder Paste Reflow Temperature Manufacturers – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG , The product will supply to all over the world, such as: Pakistan, French, Gambia, Now, we professionally supplies customers with our main products And our business is not only the "buy" and "sell", but also focus on more. We target to be your loyal supplier and long-term cooperator in China. Now, We hope to be the friends with you.
By Michelle from Bahrain - 2017.08.15 12:36
Reasonable price, good attitude of consultation, finally we achieve a win-win situation,a happy cooperation!
By Quintina from Dubai - 2017.06.19 13:51
