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China wholesale No Clean Solder Factory – Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG

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China wholesale No Clean Solder Factory – Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG Detail:

Product Description

Tin Lead Solder Pastes are made from high purity metal, The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made with 62.8% tin, 36.8% lead, and 0.4% silver content..

This kind of solder paste is a no-clean type solder cream designed for SMT production process. The paste m. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.

Features

1.With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components.

2.There are very few changes of viscosity during the continuous printing process.

3.The original shape will not be changed after several hours of printing. In addition, the surface mount assembly will not be affected.

4.Favorable wetting property on the substrate made from different materials.

Storage

Solder paste had better to be stored at a temperature range from 3℃ to 7℃. The shelf life of the unsealed product is 6 months. Furthermore, we have special one that can be stored at room temperature.

equipment.

Parameters

Spec

Sn62.8Pb36.8Ag0.4

Melting point

183℃

Specific Gravity

8.79g/cm3

Weight

500g/pcs, 10kg/carton, and available with syringe

packing

Copper Mirror Test

PASS

Product Offerings

Alloy

Powder Size

Type

Sn63Pb37

T3、T4

No-Clean

Sn55Pb45

T3、T4

No-Clean

Sn0.2AgPb

T3、T4

No-Clean

Sn0.4AgPb

T3、T4

No-Clean

Sn2.5Ag92.5Pb

T3、T4

No-Clean

FAQ

1.What are your prices?
Our prices are subject to change depending on market factors and LME. We will send you an updated price list after your company contact us for further information.

2.What are the price and payment terms?
The price terms involve EXW, FOB and CIF; The payment terms can be T/T.

3.What is the minimum order quantity of solder products?
The MOQ of solder wire is 40kg. The MOQ of solder bar is 20kg. The MOQ of solder paste is 20kg.


Product detail pictures:

China wholesale No Clean Solder Factory –  Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG detail pictures

China wholesale No Clean Solder Factory –  Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG detail pictures

China wholesale No Clean Solder Factory –  Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG detail pictures

China wholesale No Clean Solder Factory –  Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG detail pictures


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"Quality very first, Honesty as base, Sincere assistance and mutual profit" is our idea, in an effort to create consistently and pursue the excellence for China wholesale No Clean Solder Factory – Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG , The product will supply to all over the world, such as: Botswana, Czech, Madagascar, Our items are widely recognized and trusted by users and can meet continuously developing economic and social needs. We welcome new and old customers from all walks of life to contact us for future business relationships and achieving mutual success!
  • This company has a lot of ready-made options to choose and also could custom new program according to our demand, which is very nice to meet our needs.
    5 Stars By Jenny from Eindhoven - 2018.11.22 12:28
    We have been cooperated with this company for many years, the company always ensure timely delivery ,good quality and correct number, we are good partners.
    5 Stars By Margaret from Lesotho - 2018.09.12 17:18
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