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China wholesale No Clean Paste Factory – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG

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China wholesale No Clean Paste Factory – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:

Product Description

Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.

The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.

Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.

Application

The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.

Parameters

Spec

Sn96.5/Ag3.0/Cu0.5

Melting point

217℃

Specific Gravity

7.4g/cm3

Weight

450g/roll, 900g/roll, other weights can be customized

Features

1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.

2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness

3.The activated rosin flux in this product can offer superior fluxing effect.

Product Offerings

Alloy

Powder Size

Melting Point

Description

Sn0.3Ag0.7Cu

T3、T4

217-227

High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed.

Sn1.0Ag0.5Cu

T3、T4

217-227

Sn3.0Ag0.5Cu

T3、T4

217-220

Sn35Bi0.3Ag

T3、T4

172

Mid-temp,Fast flowing solder

Sn35Bi1Ag

T3、T4

151-189

Sn42Bi58

T3、T4

138

Low melting point around 138℃Good wetting characteristics

Product detail pictures:

China wholesale No Clean Paste Factory –  Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG detail pictures

China wholesale No Clean Paste Factory –  Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG detail pictures

China wholesale No Clean Paste Factory –  Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG detail pictures

China wholesale No Clean Paste Factory –  Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG detail pictures


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We attempt for excellence, provider the customers", hopes to be the most beneficial cooperation team and dominator enterprise for staff, suppliers and shoppers, realizes value share and continuous advertising for China wholesale No Clean Paste Factory – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG , The product will supply to all over the world, such as: Hongkong, Philippines, Belize, With the spirit of "credit first, development through innovation, sincere cooperation and joint growth", our company is striving to create a brilliant future with you, so as to become a most valuable platform for exporting our products in China!
  • The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
    5 Stars By Mark from Manila - 2018.06.19 10:42
    This is a honest and trustworthy company, technology and equipment are very advanced and the prodduct is very adequate, there is no worry in the suppliment.
    5 Stars By Natalie from moldova - 2017.06.16 18:23
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