China wholesale Lead Free Solder Paste Suppliers – Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG

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China wholesale Lead Free Solder Paste Suppliers – Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG Detail:

Product Description

Tin Lead Solder Pastes are made from high purity metal, The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made with 62.8% tin, 36.8% lead, and 0.4% silver content..

This kind of solder paste is a no-clean type solder cream designed for SMT production process. The paste m. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.

Features

1.With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components.

2.There are very few changes of viscosity during the continuous printing process.

3.The original shape will not be changed after several hours of printing. In addition, the surface mount assembly will not be affected.

4.Favorable wetting property on the substrate made from different materials.

Storage

Solder paste had better to be stored at a temperature range from 3℃ to 7℃. The shelf life of the unsealed product is 6 months. Furthermore, we have special one that can be stored at room temperature.

equipment.

Parameters

Spec	Sn62.8Pb36.8Ag0.4
Melting point	183℃
Specific Gravity	8.79g/cm³
Weight	500g/pcs, 10kg/carton, and available with syringe packing
Copper Mirror Test	PASS

Product Offerings

Alloy	Powder Size	Type
Sn63Pb37	T3、T4	No-Clean
Sn55Pb45	T3、T4	No-Clean
Sn0.2AgPb	T3、T4	No-Clean
Sn0.4AgPb	T3、T4	No-Clean
Sn2.5Ag92.5Pb	T3、T4	No-Clean

FAQ

1.What are your prices?
Our prices are subject to change depending on market factors and LME. We will send you an updated price list after your company contact us for further information.

2.What are the price and payment terms?
The price terms involve EXW, FOB and CIF; The payment terms can be T/T.

3.What is the minimum order quantity of solder products?
The MOQ of solder wire is 40kg. The MOQ of solder bar is 20kg. The MOQ of solder paste is 20kg.

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