China wholesale High Temperature Solder Paste Factory – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG

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During the past few years, our business absorbed and digested state-of-the-art technologies the two at home and abroad. Meanwhile, our firm staffs a group of experts devoted to your development of No Clean Solder Wire, No Clean Paste, Lead Rosin Core Solder, We always regard the technology and prospects as the uppermost. We always function hard to make terrific values for our prospects and give our customers far better products and solutions & solutions.

China wholesale High Temperature Solder Paste Factory – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:

Product Description

Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.

The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.

Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.

Application

The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.

Parameters

Spec	Sn96.5/Ag3.0/Cu0.5
Melting point	217℃
Specific Gravity	7.4g/cm³
Weight	450g/roll, 900g/roll, other weights can be customized

Features

1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.

2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness

3.The activated rosin flux in this product can offer superior fluxing effect.

Product Offerings

Alloy	Powder Size	Melting Point ℃	Description
Sn0.3Ag0.7Cu	T3、T4	217-227	High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed.
Sn1.0Ag0.5Cu	T3、T4	217-227
Sn3.0Ag0.5Cu	T3、T4	217-220
Sn35Bi0.3Ag	T3、T4	172	Mid-temp，Fast flowing solder
Sn35Bi1Ag	T3、T4	151-189
Sn42Bi58	T3、T4	138	Low melting point around 138℃Good wetting characteristics

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We emphasize progress and introduce new merchandise into the market each and every year for China wholesale High Temperature Solder Paste Factory – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG , The product will supply to all over the world, such as: Uzbekistan, Oslo, Bulgaria, As a way to make use of the resource on the expanding information and facts in international trade, we welcome prospects from everywhere on the web and offline. In spite in the top quality products and solutions we supply, effective and satisfying consultation service is supplied by our professional after-sale service group. Solution lists and thorough parameters and any other info weil be sent for you timely for the inquiries. So make sure you get in touch with us by sending us emails or contact us if you have any concerns about our firm. ou can also get our address info from our web site and come to our enterprise. or a field survey of our solutions. We're confident that we have been going to share mutual results and build solid co-operation relations with our companions in this market. We're looking forward to your inquiries.

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