China wholesale Bga Solder Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG
China wholesale Bga Solder Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:
Product Description
Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.
The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.
Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.
Application
The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.
Parameters
Spec |
Sn96.5/Ag3.0/Cu0.5 |
Melting point |
217℃ |
Specific Gravity |
7.4g/cm3 |
Weight |
450g/roll, 900g/roll, other weights can be customized |
Features
1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.
2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness
3.The activated rosin flux in this product can offer superior fluxing effect.
Product Offerings
Alloy |
Powder Size |
Melting Point ℃ |
Description |
Sn0.3Ag0.7Cu |
T3、T4 |
217-227 |
High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed. |
Sn1.0Ag0.5Cu |
T3、T4 |
217-227 |
|
Sn3.0Ag0.5Cu |
T3、T4 |
217-220 |
|
Sn35Bi0.3Ag |
T3、T4 |
172 |
Mid-temp,Fast flowing solder |
Sn35Bi1Ag |
T3、T4 |
151-189 |
|
Sn42Bi58 |
T3、T4 |
138 |
Low melting point around 138℃Good wetting characteristics |
Product detail pictures:
Related Product Guide:
We believe that prolonged time period partnership is really a result of top of the range, benefit added provider, prosperous knowledge and personal contact for China wholesale Bga Solder Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG , The product will supply to all over the world, such as: Mexico, Macedonia, luzern, To let customers be more confident in us and get the most comfortable service, we run our company with honesty, sincerity and best quality . We firmly believe that it is our pleasure to help customers to run their business more successfully, and that our experienced advice and service can lead to more suitable choice for the customers.
By Delia from Detroit - 2018.02.12 14:52
High Quality, High Efficiency, Creative and Integrity, worth having long-term cooperation! Looking forward to the future cooperation!
By Jessie from The Swiss - 2017.09.28 18:29