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China wholesale Bga Solder Paste Factories – Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG

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China wholesale Bga Solder Paste Factories – Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG Detail:

Product Description

Tin Lead Solder Pastes are made from high purity metal, The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made with 62.8% tin, 36.8% lead, and 0.4% silver content..

This kind of solder paste is a no-clean type solder cream designed for SMT production process. The paste m. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.

Features

1.With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components.

2.There are very few changes of viscosity during the continuous printing process.

3.The original shape will not be changed after several hours of printing. In addition, the surface mount assembly will not be affected.

4.Favorable wetting property on the substrate made from different materials.

Storage

Solder paste had better to be stored at a temperature range from 3℃ to 7℃. The shelf life of the unsealed product is 6 months. Furthermore, we have special one that can be stored at room temperature.

equipment.

Parameters

Spec

Sn62.8Pb36.8Ag0.4

Melting point

183℃

Specific Gravity

8.79g/cm3

Weight

500g/pcs, 10kg/carton, and available with syringe

packing

Copper Mirror Test

PASS

Product Offerings

Alloy

Powder Size

Type

Sn63Pb37

T3、T4

No-Clean

Sn55Pb45

T3、T4

No-Clean

Sn0.2AgPb

T3、T4

No-Clean

Sn0.4AgPb

T3、T4

No-Clean

Sn2.5Ag92.5Pb

T3、T4

No-Clean

FAQ

1.What are your prices?
Our prices are subject to change depending on market factors and LME. We will send you an updated price list after your company contact us for further information.

2.What are the price and payment terms?
The price terms involve EXW, FOB and CIF; The payment terms can be T/T.

3.What is the minimum order quantity of solder products?
The MOQ of solder wire is 40kg. The MOQ of solder bar is 20kg. The MOQ of solder paste is 20kg.


Product detail pictures:

China wholesale Bga Solder Paste Factories –  Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG detail pictures

China wholesale Bga Solder Paste Factories –  Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG detail pictures

China wholesale Bga Solder Paste Factories –  Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG detail pictures

China wholesale Bga Solder Paste Factories –  Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG detail pictures


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Our organization has been focusing on brand strategy. Customers' gratification is our greatest advertising. We also source OEM provider for China wholesale Bga Solder Paste Factories – Tin Lead Sn62.8Pb36.8Ag0.4 Solder Paste T3 T4 – QLG , The product will supply to all over the world, such as: Madras, Bangladesh, Malaysia, Our staffs are adhering to the "Integrity-based and Interactive Development" spirit, and the tenet of "First-class Quality with Excellent Service". According to the needs of every customer, we provide customized & personalized services to help customers achieve their goals successfully. Welcome clients from home and abroad to call and inquire!
  • The manufacturer gave us a big discount under the premise of ensuring the quality of products, thank you very much, we will select this company again.
    5 Stars By Kitty from Slovakia - 2017.11.12 12:31
    Timely delivery, strict implementation of the contract provisions of the goods, encountered special circumstances, but also actively cooperate, a trustworthy company!
    5 Stars By Sara from Ecuador - 2018.11.02 11:11
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