China wholesale 138 Bga Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG
China wholesale 138 Bga Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG Detail:
Product Description
Lead-Free Sn96.5Ag3.0Cu0.5 is composed of 96.5% tin, 3% silver, and 0.5% copper. It features relatively high cost, but bright solder joints and outstanding performance. Our company has obtained both Reach certificate and RoHS certificate for lead-free type products.
The diameter of the wire reaches to 0.15mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.
Our company has obtained Reach certificate and RoHS certificate for lead-free type products, as well SGS certificate.
Application
The Sn96.5Ag3.0Cu0.5 solder paste can be used for the soldering of the precise computer chips, mobile phone chips, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.
Parameters
|
Spec |
Sn96.5/Ag3.0/Cu0.5 |
|
Melting point |
217℃ |
| Specific Gravity |
7.4g/cm3 |
|
Weight |
450g/roll, 900g/roll, other weights can be customized |
Features
1.High Electrical Resistivity and Electrical Conductivity
Due to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process.
2.Wonderful Soldering Effects, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness
3.The activated rosin flux in this product can offer superior fluxing effect.
Product Offerings
|
Alloy |
Powder Size |
Melting Point ℃ |
Description |
|
Sn0.3Ag0.7Cu |
T3、T4 |
217-227 |
High soldering performance. The low residues after the reflow are light, transparent, electrically safe and do not have to be removed. |
|
Sn1.0Ag0.5Cu |
T3、T4 |
217-227 |
|
|
Sn3.0Ag0.5Cu |
T3、T4 |
217-220 |
|
|
Sn35Bi0.3Ag |
T3、T4 |
172 |
Mid-temp，Fast flowing solder |
|
Sn35Bi1Ag |
T3、T4 |
151-189 |
|
|
Sn42Bi58 |
T3、T4 |
138 |
Low melting point around 138℃Good wetting characteristics |
Product detail pictures:
Related Product Guide:
We emphasize advancement and introduce new products into the market each year for China wholesale 138 Bga Paste Supplier – Sn96.5Ag3.0Cu0.5 Lead Free SAC305 Silver Solder Wire – QLG , The product will supply to all over the world, such as: Puerto Rico, Borussia Dortmund, Indonesia, With the development of the society and economy, our company will continue the "loyalty, dedication, efficiency, innovation" spirit of enterprise, and we will always adhere to the management idea of "would rather lose gold, do not lose customers heart". We will serve the domestic and foreign businessmen with sincere dedication, and let us create bright future together with you!
By Octavia from Ecuador - 2018.11.11 19:52
After the signing of the contract, we received satisfactory goods in a short term, this is a commendable manufacturer.
By Olive from Albania - 2017.06.16 18:23
